Glue stencils are used when SMD components are upside-down and soldered using a wave soldering technique. For this, the glue dots are positioned with a special glue stencil on the PCB, the components can then be placed and soldered.
Metal stencils with a material thickness of 150 - 400 µm are normally used in this situation. Diameter, height and the number of adhesive points depend on the type of component geometries.
By using a glue stencil, the costs for time-consuming dispensation processes can be minimised.
We are happy to provide you with the relevant data that is required, and produce a tailor-made glue stencil for a small fee. The price depends on the amount of work required.