Table of Contents
7. Soldering SMD (vapour phase)
8. Soldering process THT (selective wave)
10. Component placement variants
14. Instructions on how to create the BOM and component placement plan for EAGLE
15. Instructions on how to create the BOM and component placement plan for Altium
16. Instructions on how to create the BOM and component placement plan for Target 3001!
17. Instructions on how to create the BOM and component placement plan for GERBER
This guide is designed to aid in allowing a problem-free component placement. Please consider the following points when placing an order with us.
1. PCB layout


2. Component placement plan

Also, connectors, terminal blocks and sockets are often drawn only as a rectangle. Please enter details for the orientation (e.g. indicate cable feed).
If any components stick out beyond the edge of the board, please indicate these accordingly. This is important for the creation of the PCB panel data.
If you order a double-sided PCB assembly, make sure that the bottom layer is mirrored when printed in, for example, a PDF. Component names and polarities must also be clearly legible here.
For an optimal presentation, we recommend hiding PCB tracks or copper planes and to show only the PCB outer contour, component contours and component names (make sure the printout has sufficient contrast).
Correct and incorrect creation of the component placement plan

- Legible component name
- Polarity of components is drawn

- Polarity of components is drawn
3. Pick & Place file

4. Bill of materials (BOM)

Component values should not be assigned more than once: e.g. 100n, 100nF etc. the specifications here must be absolutely identical to those used in your layout (Altium, Eagle, Target). The output of your Pick & Place data is taken from your layout file, which prepares the data for the automatic placement machine. If there are any differences, this may lead to incorrect placement or unnecessary delays because we will need to consult with you.
Also check that the order numbers of the components are correct. Specified values may be different (e.g.: BOM = 3k32 > order number = 3k3). Here we cannot determine if the value can still be placed (example file BOM / row 8).
If you assign components in your BOM as BETA stock components, that are NOT listed in our current stock list, we have to omit these items. Subsequent reloading or soldering is not possible. (example file BOM / line 9).
The necessary format templates can be found on our website. You can find instructions from item 14 on this page. The components that we currently have in stock can be found in the current stock list (.xlsx).5. Stencil
6. Components


Any components that are not supplied in machine-compatible production packaging cannot be assembled, in certain cases, they may have to be replaced or the component assembly can be completed manually with an additional charge (calculated on the basis of time required).
When selecting your components, check all packaging as well as the availability and lead times. We can only begin the PCB assembly process once all the required components are received.
If you provide components, ensure that they have been properly stored. For older components where this has not been the case, this can lead to problems with the soldering joints. The components you provide must be delivered in a dry condition (see IPC/JEDEC J-STD-020D; IPC/JEDEC J-STD-033B.1).

If you send us components for different projects, make sure they are marked accordingly, for example they should also have the project name. Components that are used in different projects must not be present on a single reel section, but they have to be delivered separately with the desired excess amount because we may process different orders separately and on different machines.
Package 0603 or larger: 20% more components (min. however 10)
Package 0402: 100% more components (min. however 20)
With high-value components, an excess amount (typically 1-2 pieces more) can be accepted if these components are supplied machine-compatible with the appropriate reel feed or in a rod or tray.
7. Soldering SMD (vapour phase)
8. Soldering process THT (selective wave soldering)
9. THR (Through Hole Reflow)

10. Component placement variants
11. Panel
If you order PCBs in a self-created panel format, these panels will not be separated.
12. Lead time
The following options are possible when you place your order:
Order with ≤ 300 components |
2 WD |
Order with ≤ 499 components | 12 WD standard 8 WD 4 WD |
Order with 500 - 999 components: | 14 WD standard 10 WD 8 WD |
Order with ≥ 1000 components: | 16 WD is standard, no expedited service possible. |
https://uk.beta-layout.com/pcb/technology/specifications/
13. Terms and definitions
- ESD - Electrostatic Discharge
- SMD - Surface Mount Device
- SMT - Surface Mount Technology
- THT - Through Hole Technology
- THR - Through Hole Reflow
- BOM - Bill of Material
- P&P - Pick & Place Table
- AOI - Automatic Optical Inspection
Comparison of the metric system and of the imperial system
In the metric system, the basis is the meter, in the imperial system the inch. mil stands for milli-inches or 1/1000 inch; this corresponds to 0.0254 mm.
14. Instructions on how to create the BOM and component placement plan for EAGLE
You can use these components on request in your EAGLE BOM file.
For this, components such as R-EU_ resistors, C-EU and CPOL-EU capacitors must come from the original EAGLE rcl.lbr library.
In EAGLE, use the function “Component Placement Variants”, we need a separate order for each variant, indicating which variant is to be filled with components.


Run the following ULP:
“C:Beta LAYOUTPCB-POOL BOMPCB-POOL-BOM-17.ulp”
This ULP was originally based on the BOM.ulp, which was provided with EAGLE in 2004 and improved over the years by Robert A. Rioja.
The original version can be downloaded from the CadSoft web site.

3. Your schematic tab should look like the picture on the right.
The setting “Grouped by” in the lower left corner must be set to “Same values”.
All parts that are in the
“Beta_Stock_day_month_year.BOMdb” file are automatically integrated into your Bill of Materials.

If not, you can open the file “Beta_Stock_month_year.BOMdb” with the button “Open Database”.

If not, please download the file with the “Get setup” button in the lower-right corner.
The “PCB-POOL.BOMsu” setup file must be loaded after the “Beta_Stock_day_month_year.BOMdb” database file. (See point 4).

Make sure that you have selected the table format (spreadsheet).

If you are having trouble reading a * .csv file (there is no separation of the individual field), try the following:
- rename the extension *.csv into *.txt
- open Excel
- click “open file”
- select “All files (*.*)”
- select your *.txt file
- select the text conversion wizard:
- original file type: separated
- Separator: Comma
- Place_YES/NO - Should we place this component?
- Provided_by_customer_YES/NO - Do you provide this component?
- Distributor - Where can we purchase this component?
- Order number - Under which order number does the distributor provide the component?
- Weblink - please help us find your component, especially if it is an exotic product
- Remarks_customer - your comment for this component
The component placement plan for your EAGLE-File
We require the component placement plan stored as a pdf file as additional information for component placement of you PCB.
Please note that the component placement plan also serves as a template for the final visual inspection!
Therefore, the components, component names and contours of the PCB should be clearly visible in the component placement plan.
The orientation of poled components are also indicated here (e.g., diodes, electrolytic capacitors, ICs, connectors, etc.).
Which layer do I have to show in Eagle for this?
For the component placement plan of the TOP layer, please show the following layers:
LY17: Pads
LY20: Dimension
LY21: tPlace
LY25: tNames
LY48: Document
LY51: tDocu
For the component placement plan of the BOTTOM layer, please show the following layers:
LY17: Pads
LY20: Dimension
LY22: bPlace
LY26: bNames
LY48: Document
LY52: bDocu
How do I print the component placement plan as a PDF?
To do this, in your EAGLE layout editor select the menu item “File” > “Print”.
For printer, select a pre-installed PDF writer and adjust the scale to the format DIN A4
(make sure that the DIN A4 page is well filled).
Select the sheet limit when printing to PDF to “1”.
Make sure the bottom layer has a mirrored output so that the labels are readable.
To do this set the tick under Options “Mirrored” located on the left side.
15. Instructions on how to create the BOM and component placement plan for Altium
In order for Beta LAYOUT to assemble your PCBs we need a Bill of Materials (BOM) supplied according to our specifications and we also require a component placement / assembly drawing plan.

1. Download the file “altium_e.zip”. Find the root directory of Altium Designer on your hard drive.
There you will find the subfolder “Templates”.

2. Now save the previously downloaded “assembling_beta_altium.xlt” file to this folder.
Note that in this example the specified target path / memory address may differ from that on your computer!

3. Next, open your layout with Altium Designer and select “Bill of Materials” under "Reports" in the menu bar.
A new window opens with the required information to the components present in your project.

4. To export this data to the Beta BOM template, select “Grouped Columns” in the top left of the window area by ticking the terms “Comment” and “Footprint”.
In the lower section there is the “Excel Options” with the selection box "Templates". Now select the “BetaBOM-Prototype.xlt” file previously saved to the subfolder.
Then press the “Export” button and enter the destination folder for the BOM save operation.
You should find a BOM in Excel format corresponding to our specifications.

5. Finally, we request that you fill in the missing information (yellow highlighted cells).
If specific information about components is required, enter this in the column “Customer Remarks”.
Please fill in the following fields:
- Place YES/NO - Should we place this component?
- Provided by Customer YES/NO - Will you provide this component?
- Distributor - Where can we purchase this component?
- Order number - Under which order number does the distributor provide the component?
- Customer Remarks - your comment for this component
16. Instructions on how to create the BOM and component placement plan for Target 3001!
The configuration is shown here using the example “Stepper motor” from the Target demo library making use of
Beta LAYOUT components that are available.

1. In TARGET 3001 select! Menu item -> Service -> PCB_service -> Manufacture PCB in PCB-POOL.
After you have configured your PCB according to your requirements, click on the button [Perform component placement]. Please note our instructions regarding the component placement of PCBs and the delivery of components. To do this, click on the question mark to the right of the [Component placement] button.

2. Double-click to open the line of a displayed component. Please enter all the required information in the appropriate fields.

3. Using the right mouse button you can change the placement properties of several components at the same time.
Under the listed components, you will find a box in which you can enter the desired number of PCBs on which the components are to be placed.
In the field at the bottom right, you are shown the cost of the component placement. Please note that some component costs may be missing, if they cannot be determined automatically.
With the button [Accept Component Placement], the selected placement options are taken over into the calculation of your PCB order.
The component placement plan for your TARGET-File
We require the component placement plan supplied as a pdf file as additional information for component placement of you PCB. The component placement plan is also used as a template for the final visual inspection! Therefore, the components, component names and contours of the PCB should be clearly visible in the component placement plan. The orientation of poled components are also indicated here (e.g., diodes, electrolytic capacitors, ICs, connectors, etc.).
Which layer do I have to show in TARGET for this?
For the component placement plan of the TOP layer, please show the following layers:
- LY18: Solder mask top
- LY21: Component placement top
- LY23: Board outline
- LY24: Drill holes
For the component placement plan of the BOTTOM layer, please show the following layers:
- LY04: Solder mask bottom
- LY07: Component placement bottom
- LY23: Board outline
- LY24: Drill holes
How do I print the component placement plan as a PDF?
To do this, in your TARGET layout editor select the menu item “File” > “Print”. For printer, select a pre-installed PDF writer. Tick the options “PCB outline counts” and “Centred”. Entering the scale, adjusts the presentation of your layout in the preview.
Depending on the size of the PCB, it makes sense to rotate the presentation by 90 °. To do this place a tick in “Rotate”. If you need a component placement plan for the bottom layer, then also place a tick by “Mirrored”.
17. Instructions for the component placement with Extended Gerber
In addition to the Gerber data supplied for PCB manufacture, we need extra information to complete the PCB assembly process. You can download the file “gerber_e.zip” for this purpose and review all details which are required..
1. Bill of materials (BOM)
A template showing how the desired parts list should appear can be found in German in this download (“BOM_Vorlage_2003.xls” and “BOM_Vorlage_2007.xlsx”) and in English (“BOM_Vorlage_2003_ENG.xls” and “BOM_Vorlage_2007_ENG.xlsx”).
The BOM must include all components, even those that are not to be placed.
Please use the column “Place Yes/No”.
If we are to order the components for you, we need more information about the distributor, as well as a corresponding order number. Please ensure that the components are available in a machine-compatible packaging.
2. Pick&Place file
Export this file from your layout file. In addition to the component names, component values and packaging, this also includes information on the mounting positions such as x-, y-coordinates, rotation angles and which side of the PCB is to be assembled. A demo file can be found in the Download as “Gerber_Pick&Place.txt”.
The individual columns in the file are separated with “TAB”. If relevant information has not been completely exported, you must add this later.
Apart from the components, at least two reference marks with corresponding x and y coordinates must also be listed.
Please note that these points are clearly marked in the component placement plan.
To obtain a reference point for the coordinates of the components, information must be given to the orientation of the PCB.
3. Component placement plan
Therefore, the components, component names and outer contours of the PCB should be clearly visible in the component placement plan. This is also needed for the final visual inspection.
Also, the orientation of poled components (such as diodes, electrolytic capacitors, ICs, connectors, etc.) must be identified here, as well as the reference marks specified in the Pick & Place file.
4. Stencil
So that we can produce an SMD stencil for applying the solder paste, we need the paste data for the PCB. Please include this information with the rest of the production data.