Adapter test

Aluminium core

Aluminium core circuit boards

Annular Ring

Anti Pad

AOI

Arc resistance

Aspect ratio

Assembly

Au

Autorouter

Base copper

Base material

Bevelling

BGA

Bill of Materials

Black Pad

Blind via

BOM

Bottom

Bow/twist

Breakout

Buried via

CAD

CAF resistance

CAM

Carbon

Castellated holes

CE-marking

Chemical silver

Chemical tin

Circuit diagram

Clearance

Clipping

Components

Component side

Copper

Copper adhesion

Copper balance

Copper build-up

Copper thickness

Counter sink

Courtyard

Creepage resistance

CTE

CTI

CU

Current-carrying capacity

Deburring

Delamination

Design Rules

Design Rule Check

DFA

DFM

Dielectric

Dielectric constant

Diffusion barrier

Dimension layer

DRC

Drilling

Drilling programme

Drill distance

Drill hole

E-Test

EAGLE

Edge plating

Electroless gold

Electroplating

ENIG

Epoxy resin

ESD

Etching

Eurocard

Excellon

Exposure

Extended Gerber

Feeder

Fiducials

Fine line

Fine pitch

Finished copper

Flexible printed circuit board

Flexural strength

Flying probe

Footprint

FR4

galv. Ni/Au

Gerber

GND

Gold

Ground

Ground plane

HAL

Halogen-free

HDI

Heavy copper

High frequency PCBs

High TG

Hole spacing

Immersion gold

Impedance

IMS

Inner layer

Insulation resistance

IPC

ISO 14001

ISO 9001

Kapton®

Keepout

Kitting

Lacquer and varnish

Lamination

Layer

Layout

Layout software

LDI

Lead

Lead-free

Locating holes

Microsection

Microvia

Milling

Mixed assembly

Mixed panel

Multilayer

Netlist

Nickel

Non-plated-through hole

Oblong hole

ODB++

Optical inspection

OSP

Outer layer

Package

Pad

Pad reduction

Panel

Panel frame

Peelable mask

Pertinax®

Pick & Place

PIH

Pin

Pips

Pitch

Placement/Assembly plan

Plated Through Hole

Plugged via

Polyimide

Prepreg

Press Fit Technology

Printed Circuit Board

Prototype

QFN

QFP

Rats nest

Resist

Rigid-Flex

RoHS

Routing

RTI

Schematic

Scoring

Selective soldering

Shelf life

Shielding

Sieb & Meyer

Signal integrity

Silkscreen

Silver

SMD

SMD stencil

SMT

Soldering

Solder mask

Solder mask clearance

Solder paste

Stacked vias

Stackup

Staggered vias

Stiffener

Surface finish

TARGET 3001!

Teardrop

Teflon®

Tempering

Tg

Thermal Pad

Thermal via

Thick copper

Through Hole Plating

Through Hole Via

THT

Tin stripping

Tombstone

Tooling

Tooling costs

Top

Track

Track/Gap

Track width

UL

Vapour phase

Via

Via covering

Wave soldering

Wire bonding

X-out

x-Ray

Yield

Z-axis milling