3D-MID: 3D Mechatronic Integrated Devices are three-dimensional bodies with integrated circuit structures.
The metallized thermoplastic part (MID) replaces the mix of printed circuit boards and components, which usually consists of many different materials. The 3D-MIDs are made of recyclable thermoplastics and are easier disposed of than conventional PCBs.
MIDs allow for more cost effective and faster production of circuits, and design changes can be achieved and implemented in less time.
3D-MID is now found throughout the entire range of electronics.
Whenever a higher integration of the electronics is required, such as when space and weight need to be saved, the 3D-MID is the ideal solution.
3D-MID offers the following benefits
Our main challenge was to produce an MID prototype faster and more economically, which we were not able to achieve previously with the conventional 3D-MID manufacturing and design process. The injection moulded 3D-MIDs, as used in series production require expensive injection moulding tooling and long production lead-times. Laser sintered prototypes can be manufactured at a relatively low price.
- Faster design cycles
- Small series production at lower costs
- Shorter process chains
- Savings achieved through using fewer components
- Increased functional safety